주요업무
• Design FCCSP, FCBGA, and advanced semiconductor packages.
• Develop substrate layouts from die bump assignment to BGA ball-out.
• Perform package floor planning, layer planning, bump escape,
and substrate routing.
• Collaborate with SoC, SI/PI, thermal, mechanical, and test teams to
optimize package architecture.
• Review design rules, manufacturing capability,
and OSAT assemblyrequirements.
• Lead design reviews with customers, OSATs, substrate vendors,
and internal teams.
• Review and release package design data, including layouts, netlists,
stack-ups, and artwork.
• Support DFM, design verification, fabrication, assembly, and qualification.
• Manage package specifications, checklists, and release documents.
• Identify design risks and propose technical improvements.